Interleaved conductor structure with offset traces

ABSTRACT

An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention generally relate to an interleavedconductor structure for electrically connecting a read/write head in ahard disk drive to the read/write electronics.

2. Description of the Related Art

Hard disk drives typically include a rotating rigid magnetic storagedisk and an actuator for positioning a head slider at different radiallocations relative to the axis of rotation of the disk, thereby definingnumerous concentric data storage tracks on each recording surface of thedisk. Although numerous actuator structures are known in the art,in-line rotary voice coil actuators are now most frequently employed dueto their simplicity, high performance, and their ability to be massbalanced about their axis of rotation, the latter being important formaking the actuator less sensitive to perturbations. A closed-loop servosystem within the disk drive is conventionally employed to operate thevoice coil actuator and thereby position the heads with respect to thedisk surface.

An air bearing surface on a head slider supports the head slider at asmall distance away from the surface of the magnetic disk. The headslider also includes a read/write head for writing and reading data toand from the magnetic disk. The read/write head is connected byelectrical wires or conductors to associated drive electronics, e.g., aproximately located preamplifier chip and downstream read channelcircuitry typically carried on a circuit board (along with othercircuitry) that is attached to the head/disk assembly. Single read/writehead designs typically require two wire connections while dual designshaving separate reader and writer elements require four wireconnections. Magnetoresistive (MR) heads in particular generally requirefour wires. Head sliders are generally mounted to a gimbaled flexurestructure attached to the distal end of a suspension's load beamstructure, which in turn is connected to the actuator. A spring biasesthe load beam and the head slider towards the disk, while the airpressure beneath the head slider pushes the head slider away from thedisk. An equilibrium distance defines an “air bearing” and determinesthe “flying height” of the head slider.

The disk drive industry has been progressively decreasing the size andmass of the head slider structures in order to reduce the moving mass ofthe actuator assembly and to permit closer operation of the transducerto the disk surface, the former giving rise to improved seek performanceand the latter giving rise to improved transducer efficiency that canthen be traded for higher areal density. Smaller slider structuresgenerally require more compliant gimbals, hence the intrinsic stiffnessof the conductor wires attached to the head slider can give rise to asignificant undesired bias effect. To reduce the effects of thisintrinsic wire stiffness or bias, structures have been proposed whichinclude hybrid stainless steel flexure and conductive structures. Suchhybrid designs typically employ stainless steel flexures havingdeposited insulating and conductive trace layers for electricalinterconnection of the head to the associated drive electronics.Included with these integrated conductor designs is relatively shortflex electronics carrier (FEC).

These hybrid flexure designs employ relatively lengthy runs of conductortrace pairs or four-wire sets which extend from bonding pads at thedistal, head-mounting end of the flexure to the proximal end of theflexure. Theses traces provide a conductive path from the read/writehead along the length of the associated suspension structure to thepreamplifier or read-channel chip(s). Because the conductor traces arepositioned extremely close to, but electrically isolated from, theconductive stainless steel flexure structure which is in turn groundedto the load beam, and because of the relatively high signal rates beingtransferred, the conductor trace inductance and mutual coupling, as wellas conductor trace resistance and trace capacitance to ground, can giverise to unwanted signal losses, reflections, distortion, and inefficientsignal/power transfer. The unwanted signal losses and reflections tendto deleteriously affect the performance of the read/write head,interconnect structure, and driver/preamplifier circuit.

SUMMARY OF THE INVENTION

The present invention generally provides for an interleaved conductorstructure for electrically connecting a read/write head in a hard diskdrive. The disclosed interleaved conductor structure allows for anincreased characteristic-impedance range, greater interference shieldingand a reduction of signal loss that is contributed by a lossy conductivesubstrate.

In one embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, and a first plurality of electrical tracesdisposed on the first electrical insulation layer. Each electrical traceof the first plurality of electrical traces has a first width. Thestructure also includes a second electrical insulation layer disposed onthe first plurality of electrical traces and a second plurality ofelectrical traces disposed on the second electrical insulation layer.Each electrical trace of the second plurality of electrical traces has asecond width that is different than the first width. The first andsecond plurality of electrical traces each include negative and positivephase traces, and the first plurality of electrical traces areinterleaved relative to the second plurality of electrical traces.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, and a first plurality of electrical tracesdisposed on the first electrical insulation layer. Each electrical traceof the first plurality of electrical traces has a first width. Thestructure also includes a second electrical insulation layer disposed onthe first plurality of electrical traces and a second plurality ofelectrical traces disposed on the second electrical insulation layer.Each electrical trace of the second plurality of electrical traces has asecond width that is different than the first width. The first andsecond plurality of electrical traces each include negative and positivephase traces. The first plurality of electrical traces are interleavedrelative to the second plurality of electrical traces. The structurealso includes a third electrical insulation layer disposed on the secondplurality of electrical traces and a top conductive shield layerdisposed on the third electrical insulation layer.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, and a first plurality of electrical tracesdisposed on the first electrical insulation layer. Each electrical traceof the first plurality of electrical traces has a first width. Thestructure also includes a second electrical insulation layer disposed onthe first plurality of electrical traces and a second plurality ofelectrical traces disposed on the second electrical insulation layer.Each electrical trace of the second plurality of electrical traces has asecond width that is different than the first width. The structure alsoincludes a third electrical insulation layer disposed on the secondplurality of electrical traces and a third plurality of electricaltraces disposed on the third electrical insulation layer. Eachelectrical trace of the third plurality of electrical traces has a thirdwidth that is different than at least one of the first width and thesecond width. The first, second and third plurality of electrical traceseach include negative and positive phase traces. The first plurality ofelectrical traces are interleaved relative to the second plurality ofelectrical traces and the second plurality of electrical traces areinterleaved relative to the third plurality of electrical traces.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, and a first plurality of electrical tracesdisposed on the first electrical insulation layer and spaced apart by afirst distance. Each electrical trace of the first plurality ofelectrical traces has a first width. The structure also includes asecond electrical insulation layer disposed on the first plurality ofelectrical traces and a second plurality of electrical traces disposedon the second electrical insulation layer and spaced apart by a seconddistance that is substantially equal to the first distance. Eachelectrical trace of the second plurality of electrical traces has asecond width, wherein each electrical trace of the second plurality ofelectrical traces is offset from each electrical trace of the firstplurality of electrical traces. The first and second plurality ofelectrical traces each include negative and positive phase traces, andthe first plurality of electrical traces are interleaved relative to thesecond plurality of electrical traces.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, and a first plurality of electrical tracesdisposed on the first electrical insulation layer and spaced apart by afirst distance. Each electrical trace of the first plurality ofelectrical traces has a first width. The structure also includes asecond electrical insulation layer disposed on the first plurality ofelectrical traces and a second plurality of electrical traces disposedon the second electrical insulation layer and spaced apart by a seconddistance substantially equal to the first distance. Each electricaltrace of the second plurality of electrical traces is offset from eachelectrical trace of the first plurality of electrical traces. The firstand second plurality of electrical traces each include negative andpositive phase traces, and the first plurality of electrical traces areinterleaved relative to the second plurality of electrical traces. Thestructure also includes a third electrical insulation layer disposed onthe second plurality of electrical traces and a top conductive shieldlayer disposed on the third electrical insulation layer.

In another embodiment, an interleaved conductor structure includes aconductive underlayer having at least one aperture extendingtherethrough, a first conductive layer disposed on the conductiveunderlayer, a first electrical insulation layer disposed on the firstconductive layer, and a first plurality of electrical traces disposed onthe first electrical insulation layer and spaced apart by a firstdistance. Each electrical trace of the first plurality of electricaltraces has a first width. The structure also includes a secondelectrical insulation layer disposed on the first plurality ofelectrical traces and a second plurality of electrical traces disposedon the second electrical insulation layer and spaced apart by a seconddistance substantially equal to the first distance. Each electricaltrace of the second plurality of electrical traces is offset from eachelectrical trace of the first plurality of electrical traces. The firstand second plurality of electrical traces each include negative andpositive phase traces, and the first plurality of electrical traces areinterleaved relative to the second plurality of electrical traces. Thestructure also includes a third electrical insulation layer disposed onthe second plurality of electrical traces and a top conductive shieldlayer disposed on the third electrical insulation layer.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe first conductive layer, a first positive phase electrical tracedisposed on the first electrical insulation layer having a first end anda second end, and a first negative phase electrical trace disposed onthe first electrical insulation layer having a third end and a fourthend and spaced apart from the first positive phase electrical trace. Thestructure also includes a second electrical insulation layer disposed onthe first positive phase electrical trace and the first negative phaseelectrical trace. The structure also includes a second positive phaseelectrical trace disposed on the second electrical insulation layer,vertically aligned with the first negative phase electrical trace andhaving a fifth end vertically aligned with the first end and a sixth endvertically aligned with the second end. The structure also includes asecond negative phase electrical trace disposed on the second electricalinsulating layer and having a seventh end and an eighth end and spacedapart from the second positive phase electrical trace.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, a first positive phase electrical tracedisposed on the first electrical insulation layer having a first end anda second end, and a first negative phase electrical trace disposed onthe first electrical insulation layer having a third end and a fourthend and spaced apart from the first positive phase electrical trace. Thestructure also includes a second electrical insulation layer disposed onthe first positive phase electrical trace and the first negative phaseelectrical trace. The structure also includes a second positive phaseelectrical trace disposed on the second electrical insulation layer,vertically aligned with the first negative phase electrical trace andhaving a fifth end vertically aligned with the first end and a sixth endvertically aligned with the second end. The structure also includes asecond negative phase electrical trace disposed on the second electricalinsulating layer and having a seventh end and an eighth end and spacedapart from the second positive phase electrical trace, a thirdelectrical insulation layer disposed on the second positive phaseelectrical trace and the second negative phase electrical trace, and athird positive phase electrical trace disposed on the third electricalinsulation layer, vertically aligned with the first positive phaseelectrical trace and having a ninth end vertically aligned with thefirst end and a tenth end vertically aligned with the second end. Thestructure also includes a third negative phase electrical trace disposedon the third electrical insulating layer and having an eleventh end anda twelfth end and spaced apart from the third positive phase electricaltrace.

In another embodiment, an interleaved conductor structure includes aconductive underlayer, a first electrical insulation layer disposed overthe conductive underlayer, a first positive phase electrical tracedisposed on the first electrical insulation layer having a first end anda second end, and a first negative phase electrical trace disposed onthe first electrical insulation layer having a third end and a fourthend and spaced apart from the first positive phase electrical trace. Thestructure also includes a second electrical insulation layer disposed onthe first positive phase electrical trace and the first negative phaseelectrical trace. The structure also includes a second positive phaseelectrical trace disposed on the second electrical insulation layer,vertically aligned with the first negative phase electrical trace andhaving a fifth end vertically aligned with the first end and a sixth endvertically aligned with the second end. The structure also includes asecond negative phase electrical trace disposed on the second electricalinsulating layer and having a seventh end and an eighth end and spacedapart from the second positive phase electrical trace and a thirdelectrical insulation layer disposed on the second positive phaseelectrical trace and the second negative phase electrical trace. Thestructure also includes a third positive phase electrical trace disposedon the third electrical insulation layer, vertically aligned with thefirst positive phase electrical trace and having a ninth end verticallyaligned with the first end and a tenth end vertically aligned with thesecond end. The structure also includes a third negative phaseelectrical trace disposed on the third electrical insulating layer andhaving an eleventh end and a twelfth end and spaced apart from the thirdpositive phase electrical trace, a fourth electrical insulation layerdisposed on the third positive phase electrical trace and the thirdnegative phase electrical trace, and a fourth positive phase electricaltrace disposed on the fourth electrical insulation layer, verticallyaligned with the third negative phase electrical trace and having athirteenth end vertically aligned with the first end and a fourteenthend vertically aligned with the second end. The structure also includesa fourth negative phase electrical trace disposed on the fourthelectrical insulating layer and having a fifteenth end and an sixteenthend and spaced apart from the fourth positive phase electrical trace.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 shows a disk drive having a magnetic disk, and a head slider witha magnetic read/write head mounted on an actuator, according to anembodiment of the invention.

FIG. 2A-2E are cross sectional isometric views of an interleavedconductor structure according to various embodiments.

FIGS. 3A-3E are isometric views showing interleaved conductor structuresaccording to various embodiments of the invention.

FIGS. 3F and 3G are schematic cross sectional views of interleavedconductor structures showing the spacing between adjacent traces.

FIGS. 4A and 4B are isometric views showing interleaved conductorstructures according to various embodiments of the invention.

FIGS. 5A and 5B are schematic illustrations of the trace layout patternsaccording to various embodiments of the invention.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation.

DETAILED DESCRIPTION

In the following, reference is made to embodiments of the invention.However, it should be understood that the invention is not limited tospecific described embodiments. Instead, any combination of thefollowing features and elements, whether related to differentembodiments or not, is contemplated to implement and practice theinvention. Furthermore, although embodiments of the invention mayachieve advantages over other possible solutions and/or over the priorart, whether or not a particular advantage is achieved by a givenembodiment is not limiting of the invention. Thus, the followingaspects, features, embodiments and advantages are merely illustrativeand are not considered elements or limitations of the appended claimsexcept where explicitly recited in a claim(s). Likewise, reference to“the invention” shall not be construed as a generalization of anyinventive subject matter disclosed herein and shall not be considered tobe an element or limitation of the appended claims except whereexplicitly recited in a claim(s).

The present invention provides an interleaved conductor structure forelectrically connecting a read/write head in a hard disk drive. In someembodiments, the disclosed interleaved conductor structure allows for anincrease in manufacturing tolerance in the alignment of stacked layersof the structure. Additionally, the periodic offset provides widercharacteristic-impedance ranges. The periodic offset of the tracesallows for more control over the final impedance as the final design isdetermined. In order to keep the relative same propagation velocity, theoffset of the traces is periodic.

FIG. 1 shows one embodiment of a magnetic hard disk drive 10 thatincludes a housing 12 within which a magnetic disk 14 is fixed to aspindle motor (SPM) by a clamp. The SPM drives the magnetic disk 14 tospin at a certain speed. A head slider 18 includes a head element 11that accesses a recording area of the magnetic disk 14 and a slider towhich the head element 11 is fixed. The head slider 18 is provided witha fly-height control which adjusts the flying height of the head abovethe magnetic disk 14. An actuator 16 carries the head slider 18 andincludes an elongated conductive suspension member 19 b. The elongatedconductive suspension member 19 b is flexible to provide a spring actionto the actuator 16 and, in one embodiment, is formed from anon-corrosive metal such as stainless steel. In FIG. 1, the actuator 16is pivotally held by a pivot shaft, and is pivoted around the pivotshaft by the drive force of a voice coil motor (VCM) 17 as a drivemechanism. The actuator 16 is pivoted in a radial direction of themagnetic disk 14 to move the head slider 18 to a desired position. Dueto the viscosity of air between the spinning magnetic disk 14 and thehead slider's air bearing surface (ABS) facing the magnetic disk 14, apressure acts on the head slider 18. The head slider 18 flies low abovethe magnetic disk 14 as a result of this pressure balancing between theair and the force applied by the elongated conductive suspension member19 b toward the magnetic disk 14. As shown in the FIG. 1, the elongatedconductive suspension member 19 b acts as an integrated conductiveunderlayer for the electrical connection assembly 15 providingstructural support. The conductive underlayer can also be constructedwith a stiffener layer of conductive material such as aluminum, copper,or gold. In some cases, the conductive underlayer may be comprised of acombination of the stiffener layer of conductive material connected tothe elongated conductive suspension member 19 b. All description hereinreferring to the conductive underlayer 19 and the electrical connectionassembly 15 as an “interleaved structure” or a “interleaved conductorstructure” is understood to cover the use of either the stiffener layerof conductive material, the integrated elongated conductive suspensionmember 19 b, or both the stiffener layer of conductive materialconnected to the elongated conductive suspension member 19 b.

An electrical connection assembly 15 is disposed on the elongatedconductive suspension member 19 b and electrically connects the variouscomponents of the head 11 (write head, read head, etc.) to associatedcircuitry 13 located remote from the head 11. The electrical connectionassembly 15 and the elongated conductive suspension member 19 b form aninterleaved conductor structure that supports the head 11 and the headslider 18 adjacent to the magnetic recording disk 14 and electricallyconnects the head 11 to the associated circuitry 13. It is to beunderstood that there are numerous mechanisms for the traces to end upat the read/write head such as: (i) down the side of flexure as shown inU.S. Pat. No. 6,351,348, which is incorporated by reference; (ii) aroundthe outside as in shown in U.S. Patent Application Publication No.2009/0244786, which is incorporated by reference; or (iii) down themiddle of flexure as shown in FIG. 1.

FIG. 2A shows a cross sectional isometric view of a portion of aninterleaved conductor structure 214 that includes a conductiveunderlayer 19 as a supporting substrate for the electrical connectionassembly 15. The conductive underlayer 19 has a bottom surface 202(facing the magnetic disk 14), a top surface 204 (facing away from themagnetic disk 14) and a width W extending in the transverse direction ofthe actuator 16. The portion of the conductive underlayer 19 shown inFIGS. 2A-2E has a unit length L extending in the longitudinal directionof the actuator 16. In this embodiment, the electrical connectionassembly 15 includes an electrical insulation layer 206 disposed on thetop surface 204 of the conductive underlayer 19. A plurality (two inthis embodiment) of electrical traces 208 is disposed on the electricalinsulation layer 206. In some embodiments, the plurality of electricaltraces 208 include at least one positive phase trace (labeled P), and atleast one negative phase trace (labeled N). Write and read signals arecoupled to and from the read/write head 11 as an electrical signalbetween the P and N traces. The plurality of electrical traces 208 areusually formed of a highly conductive material such as gold (Au) orcopper (Cu). The electrical insulation layer 206 electrically isolatesthe plurality of electrical traces 208 from the conductive underlayer 19and is formed of a dielectric material, which in some embodiments is apolymer such as polyimide.

In the embodiment of FIG. 2A, the conductive underlayer 19 includes aplurality of apertures or windows 212 formed therethrough from thebottom surface 202 to the top surface 204. The plurality of apertures212 formed through the conductive underlayer 19 reduces the amount oflossy material in close proximity to the electrical connection assembly15 and thereby reduces the amount of signal loss caused by the materialof the conductive underlayer 19. While the apertures 212 are shown asextending completely through the conductive underlayer 19, in someembodiments, they may extend only partially through (similar to a blindbore) the conductive underlayer 19. In either embodiment, the reducedamount of lossy material reduces the amount of signal loss.

The conductive underlayer 19 of FIGS. 2A-2E has a unit area that isdefined by its unit length L and its average width W along the unitlength L. In some embodiments, the width may vary over the length of theconductive underlayer 19 as shown in FIG. 1, wherein the elongatedconductive suspension member 19 b tapers towards the head 11. Theportion of the plurality of apertures 212 that are within the unit areaform open regions that have a second area (the combined area of theopenings) within the unit area. In one embodiment, the ratio of the areaof the openings within the unit area to the total unit area of theconductive underlayer 19 is between about 1:1 and about 1:500. Inembodiments where the plurality of apertures 212 have straight sidewalls (as shown in the figures), this ratio represents the percentage ofmaterial removed from the conductive underlayer 19. The removal of lossymaterial from the conductive underlayer 19 allows for the adjustment ofthe characteristic impedance to a desired level and reduces signal lossthat is caused by the lossy material. The air/material ratio is notnecessarily uniform along the entire length of the conductive underlayer19, and in some embodiments may be varied to provide differentcharacteristic impedances at different points along the length of theconductive underlayer 19. In addition, the shapes of the apertures 212need not be rectangular as shown, and various shapes such as circular,ovoid, square, etc. are contemplated. It should also be noted that theelectrical connection assembly 15 and the electrical insulation layer206 disposed on the top surface 204 of the conductive underlayer 19 isnot necessarily in the center of the conductive underlayer 19, as shownin the drawings, and may be closer to one longitudinal side or the otherlongitudinal side of the conductive underlayer 19. The apertures 212also are not necessarily centered in the conductive underlayer 19, andin some embodiments extend only in those areas where the removal of thelossy material of the conductive underlayer 19 is advantageous, inparticular under or proximate the electrical connection assembly 15.

Also in the embodiment of FIG. 2A, the electrical connection assembly 15is in the form of a bi-layer interleave conductor structure (BICS). TheBICS electrical connection assembly 15 includes an electrical insulationlayer 206 that electrically isolates a first plurality of electricaltraces 208 from the conductive underlayer 19. Above the first pluralityof electrical traces 208 is a second electrical insulation layer 216 anda second plurality of electrical traces 218 such that a portion 220 ofthe second electrical insulating layer 216 is present between adjacenttraces. The second plurality of electrical traces 218 includes at leastone positive phase trace (labeled P), and at least one negative phasetrace (labeled N). The positive phase trace and the negative phase traceof the second plurality of electrical traces 218 are reversed relativeto the positive phase trace and the negative phase trace of the firstplurality of electrical traces 208, to thereby form the BICS. Byinterleaving the signal lines in this manner, a wider range of thecharacteristic impedance can be achieved for a given insulatorthickness. While only two layers of electrical traces are shown in FIG.2A, it should be understood that the multiple interleaving layers can bereplicated to reach the desired characteristic impedance level.

In FIG. 2B a cross sectional isometric view of one embodiment of aninterleaved conductor structure 232 is shown. The interleaved conductorstructure 232 provides shielding through the use of conductive sidewalls234 that rest on the first conductive layer 224. The conductivesidewalls 234 are located on either side of the electrical connectionassembly 15. In some embodiments, a plurality of spaced vias 236 formedthrough electrically insulating material are filled with electricallyconductive material that electrically connects the conductive sidewalls234 to a top conductive shield layer 230. It is to be understood thatmore or less vias may be utilized to have the same effect. Suitableconductive materials that may be used for the conductive sidewalls 234,conductive shield layer 230, first conductive layer 224, andelectrically conductive material that fills vias 236 such as copper or acopper alloy. To fabricate the structure 232, an insulating layer isformed over the second plurality of electrical traces 218, the vias 236are formed therethrough, the electrically conductive material then fillsthe vias 236, and finally the conductive shield layer 230 is depositedthereon. In one embodiment, the conductive sidewalls 234 and the topconductive shield layer 230 may be covered by an outer dielectricmaterial 238. In one embodiment, a highly conductive first conductivelayer 224 is disposed over the structure and is copper-based, althoughother highly conductive materials such as gold may be used. The firstconductive layer 224 provides for low signal loss with a low impedancelevel from substrate coupling. The first conductive layer 224 may beused in conjunction with features from the various other embodiments ofthe interleaved conductor structure.

FIG. 2C depicts a cross sectional isometric view of a sixth embodimentof the interleaved conductor structure 240. The interleaved conductorstructure 240 is substantially similar to the interleaved conductorstructure 232 of FIG. 2B. However, in the interleaved conductorstructure 240 the conductive sidewalls 234 extend completely to the topconductive shield layer 230, without the need for the plurality of vias236. By extending the conductive sidewalls 234 to the top conductiveshield layer 230, the electrical connection between the conductivesidewalls 234 and the top conductive shield layer 230 is improved, and amore continuous shield structure is formed.

In FIG. 2D a cross sectional isometric view of a seventh embodiment ofthe interleaved conductor structure 242 is shown. The interleavedconductor structure 242 is substantially similar to the interleavedconductor structure 240 of FIG. 2C. However, in the interleavedconductor structure 242 a plurality of vias 244 electrically connectsthe conductive sidewalls 234 to the first conductive layer 224. In someembodiments, the first conductive layer 224 is omitted, and the vias 244connect the conductive sidewalls 234 to the conductive underlayer 19. Byelectrically connecting the conductive sidewalls 234 (and the topconductive shield layer 230) to the underlying support, the shieldstructure is at the same electrical potential as the underlying support,thereby providing improved control of the characteristic impedance andimproved shielding.

FIG. 2E depicts a cross sectional isometric view of an eighth embodimentof the interleaved conductor structure 246. The interleaved conductorstructure 246 is substantially similar to the interleaved conductorstructure 242 of FIG. 2D. However, in the interleaved conductorstructure 246 of FIG. 2E the conductive sidewalls 234 extend to contactthe first conductive layer 224, without the need for the plurality ofvias 244. By extending the conductive sidewalls 234 to the firstconductive layer 224, the electrical connection between the conductivesidewalls 234 and the first conductive layer 224 is improved, and a morecontinuous shield structure is formed. In some embodiments, the firstconductive layer 224 is omitted, and the conductive sidewalls 234 extendto the conductive underlayer 19. In one embodiment, the interleavedconductor structure 246 provides a shield structure that completelysurrounds the electrical connection assembly 15 similar to the shield ina coaxial cable.

FIG. 3A is a schematic isometric view of an interleaved conductorstructure 300 according to one embodiment. The structure 300 includes abottom conductive layer 302 and a first electrical insulation layer 304formed thereover. The first electrical insulation layer 302 may bepatterned to form slots into which a first plurality of electricaltraces 306 are formed. In the embodiment shown in FIG. 3A, there are twoelectrical traces 306 with one being a positive phase trace (labeled P)and one being a negative phase trace (labeled N). An area 314 ofelectrical insulation remains between the traces 306. A secondelectrical insulation layer 308 is formed over the first plurality ofelectrical traces 306. Similar to the first electrical insulation layer304, the second electrical insulation layer 308 is patterned to formslots into which a second plurality of electrical traces 310 are formed.In the embodiment shown in FIG. 3A, there are two electrical traces 310with one being a positive phase trace (labeled P) and one being anegative phase trace (labeled N). An area 316 of electrical insulationremains between the traces 310. A third electrical insulation layer 312is formed over the second plurality of electrical traces 310.

The first plurality of electrical traces 306 have a first width B andthe second plurality of electrical traces 310 have a second width A. Thebottom or first plurality of electrical traces 306 are wider than thetop or second plurality of electrical traces 310. The distance betweenadjacent traces of the first plurality of electrical traces 306 issubstantially equal to the distance between adjacent traces of thesecond plurality of electrical traces 310 as shown by arrow C. The widthof the traces 306, 310 is within about 30 percent to about 85 percent ofeach other. It is contemplated that the width of the traces 306, 310 maybe within about 50 percent to about 75 percent of each other. In theembodiment shown in FIG. 3A, at least one edge of each trace of thesecond plurality of electrical traces 310 is vertically aligned with atleast one edge of a trace of the first plurality of electrical traces306 that is directly therebelow.

It can be quite difficult to produce traces of the exact same width ontwo different levels in which the edges are vertically aligned.Therefore, to increase the manufacturing tolerance, the second pluralityof electrical traces 310 may simply be disposed over the first pluralityof electrical traces 306 without regard to whether any edges arealigned. The second plurality of electrical traces 310 may be centeredover the first plurality of electrical traces 306 rather than having atleast one edge aligned. In the embodiment shown in FIG. 3A, the bottomor first plurality of electrical traces 306 has a greater width than thetop or second plurality of electrical traces 310 so that the bottom orfirst plurality of electrical traces 306 may be used as a reference whenforming the top or second plurality of electrical traces 310. It iscontemplated that the top or second plurality of electrical traces 310may be formed anywhere within the width of the first plurality ofelectrical traces 306. Even though the traces 306, 310 have differentwidths, there is no impedance dropoff. In particular, the impedancerange for the structure 300 may be between about 10 ohm to about 40 ohm.While not shown, it is contemplated that the second plurality ofelectrical traces 310 may have a greater width than the first pluralityof electrical traces 306.

It is contemplated that more than two layers of traces may be utilized.FIGS. 3B-3D are schematic isometric illustrations of three layer tracestructures. In FIG. 3B, the interleaved conductor structure 320 has athird plurality of electrical traces 322 formed above the thirdelectrical insulation layer 312. A fourth electrical insulation layer324 is formed thereover. In the embodiment of FIG. 3B, the firstplurality of electrical traces 306 has a width E that is greater thanthe width of both the second plurality of electrical traces 310 and thethird plurality of electrical traces 322. However, the second pluralityof electrical traces 310 and the third plurality of electrical traces322 have substantially the same width as shown by arrows D.Additionally, in the embodiment shown in FIG. 3B, at least one edge ofall of the traces 306, 310, 322 is vertically aligned and thus, arespaced apart by substantially the same distance as shown by arrow F.Similar to FIG. 3A, the bottom or first plurality of electrical traces306 has a greater width than both the second plurality of electricaltraces 310 and the third plurality of electrical traces 322 so that thefirst plurality of electrical traces 306 may be used as a reference whenforming the second plurality of electrical traces 310 and the thirdplurality of electrical traces 322. It is contemplated that the secondplurality of electrical traces 310 and the third plurality of electricaltraces 322 may be formed anywhere within the width of the firstplurality of electrical traces 306.

In the embodiment shown in FIG. 3C, interleaved conductor structure 330has three separate trace levels. The second plurality of electricaltraces 310 has a greater width than both the first plurality ofelectrical traces 306 and the third plurality of electrical traces 322.The first plurality of electrical traces 306 and the third plurality ofelectrical traces 322 have substantially the same diameter and at leastone edge of each trace is vertically aligned with another trace. Similarto FIG. 3B, the second plurality of electrical traces 310 may be used asa reference when forming the third plurality of electrical traces 322.It is contemplated that the first plurality of electrical traces 306 andthe third plurality of electrical traces 322 may be formed anywherewithin the width of the second plurality of electrical traces 310.

In the embodiment shown in FIG. 3D, the interleaved conductor structure340 has three separate trace levels. The third plurality of electricaltraces 322 and the first plurality of electrical traces 306 have agreater width than the second plurality of electrical traces 310. Thefirst plurality of electrical traces 306 and the third plurality ofelectrical traces 322 have substantially the same diameter and at leastone edge of each trace is vertically aligned with another trace. Similarto FIG. 3B, the first plurality of electrical traces 306 may be used asa reference when forming the second plurality of electrical traces 310and the third plurality of electrical traces 322. It is contemplatedthat the second plurality of electrical traces 310 may be formedanywhere within the width of the second plurality of electrical traces310.

As shown in FIG. 3E, the interleaved conductor structure 350 may have aconductive overlayer 352 on top of an electrical insulation layer as hasbeen described above. It is to be understood that each conductorsstructure discussed herein in each embodiment is contemplated to haveone or more of a conductive overlayer 352, one or more apertures 212formed through the conductive underlayer 19, vias 244, conductivesidewalls 234 and outer dielectric material 238 as described above. Theconductive overlayer 352, the bottom conductive layer 302, theconductive sidewalls 234 each can individually function to shield thetraces and to reduce the impedance.

As shown by FIGS. 3F and 3G, the spacing between the traces for may bedifferent. The first plurality of electrical traces 306 have a spacing Gthat is less than the spacing for the second plurality of electricaltraces 310 as shown by H in FIG. 3F. However, the second plurality oftraces 310 are each disposed within the width of a corresponding traceof the first plurality of traces 306. In FIG. 3G, the second pluralityof traces 310 are again spaced a greater distance as shown by J ascompared to the first plurality of traces 306 as shown by I. However,one of the traces of the second plurality of electrical traces 310 hasan edge that is vertically aligned with an edge of a corresponding traceof the first plurality of electrical traces 306. Another trace of thesecond plurality of electrical traces 310 is substantially centered overa corresponding trace of the first plurality of electrical traces 306.It is to be understood that while FIGS. 3F and 3G refer to embodimentswhere the first plurality of electrical traces 306 have a greater widththan the second plurality of electrical traces 310, the spacingdifferences apply equally to the situation where the first plurality ofelectrical traces 306 have a smaller width than the second plurality ofelectrical traces 310.

FIGS. 4A and 4B are isometric views showing interleaved conductorstructures 400, 430 according to various embodiments of the invention.In FIGS. 4A and 4B, the traces at the different levels are offset andhave a serpentine appearance. FIGS. 4A and 4B show interleaved conductorstructures 400, 430 having a bottom conductive layer 402, an electricalinsulation layer 404 formed thereover, a first plurality of conductivetraces 406 formed within a slot in the first electrical insulation layer404, a second electrical insulation layer 408 formed over the firstplurality of electrical traces 406, and a second plurality of electricaltraces 410 formed within slots that are cut into the second electricalinsulation layer 408. In each of FIGS. 4A and 4B, the second pluralityof electrical traces 410 are offset from the first plurality ofelectrical traces 406.

Offsetting the second plurality of electrical traces 410 from the firstplurality of electrical traces 406 increases the impedance range of thestructures 400, 430 relative to structures in which the traces are notoffset. More specifically, the offset provides a wider characteristicimpedance range for the structures 400, 430. Offsetting the secondplurality of electrical traces 410 from the first plurality ofelectrical traces 406 from center increases the impedance. Theadjustability afforded by offsetting the traces allows for more controlover the impedance in the final design of the structure 400, 430. InFIGS. 4A and 4B, the offset is periodic such that each trace pair has adifferent impedance level (Z=sqrt(L/C)) increasing the inductance (L),and decreasing the capacitance (C) between the second plurality ofelectrical traces 410 and the first plurality of electrical traces 406.Therefore, trace swapping between the second plurality of electricaltraces 410 and the first plurality of electrical traces 406 is importantto keep the desired impedance level. The impedance requirements in thefinal design of the hard drive could be altered bypreamp/arm-electronics design specifications (e.g., to match theimpedance), read-write head design specification (e.g., to match theimpedance), scalability (e.g., different armature length between 3.5″and 2.5″ drives), and the need for additional traces for the nextgeneration drives (e.g., for the thermal fly-height control, thermalassisted writing, and thermal asperity detection). The periodic maximumtrace length should be set to less than 1/10 of the wavelength of themaximum symbol transfer rate; whereas the periodicity does not have asignificant effect on the impedance levels for the required frequencyrange (symbol transfer). Lower periodic trance lengths would causeripples in the time-domain response.

In the embodiments shown in FIGS. 4A and 4B, the first plurality ofelectrical traces 406 each have the same width. Similarly, the secondplurality of electrical traces 410 each have the same width. The widthof the first plurality of electrical traces 406 is substantially equalto the width of the second plurality of electrical traces 410. Thedistance between adjacent traces in the first plurality of electricaltraces 406 is substantially equal to the width of each of the secondplurality of electrical traces 410. Similarly, the distance betweenadjacent traces in the second plurality of electrical traces 410 issubstantially equal to the width of each of the first plurality ofelectrical traces 406. Thus, any cross-talk effects are balanced.Additionally, the traces are vertically aligned along the edges.

FIGS. 5A and 5B are schematic top view illustrations of trace layoutpatterns according to various embodiments of the invention. It is to beunderstood that the trace layout patterns shown in FIGS. 5A and 5B areapplicable to the interleaved conductor structures discussed above. FIG.5A shows a two level trace pattern. For the first plurality ofelectrical traces 500, the positive phase trace has two ends 502, 506connected by a middle section 510. Similarly, the negative phase tracehas two ends 504, 508 connected by a middle section 512. Over the firstplurality of electrical traces 500, an insulating layer may be depositedover which the second plurality of electrical traces 501 is formed. Thesecond plurality of conductive traces 501 includes a positive phasetrace and a negative phase trace. The negative phase trace of the secondplurality of electrical traces 501 is connected to the negative phasetrace of the first plurality of electrical traces 500 at the ends 516,520 to the ends 504, 508 of the negative phase trace of the firstplurality of electrical traces 500. The ends 516, 520, 504, 508 areconnected by vertical vias formed through the intervening layers.However, even though the negative phase trace of the second plurality ofelectrical traces 501 is connected to the negative phase trace of thefirst plurality of electrical traces 500, the middle section 530 of thenegative phase trace of the second plurality of electrical traces 501 isvertically aligned with the middle section 510 of the positive trace ofthe first plurality of electrical traces 500. In order to verticallyalign the middle sections 530, 510, the negative phase trace of thesecond plurality of electrical traces 501 wraps around the end 518 ofthe positive phase trace of the second plurality of electrical traces501 with a wrap around section 528 and the trace angles over by way of aslanted portion 532 to the middle section 530.

Similarly, the positive phase trace of the second plurality ofelectrical traces 501 is connected to the positive phase trace of thefirst plurality of electrical traces 500 at the ends 514, 518 to theends 502, 506 of the positive phase trace of the first plurality ofelectrical traces 500. The ends 514, 518, 502, 506 are connected byvertical vias formed through the intervening layers. However, eventhough the positive phase trace of the second plurality of electricaltraces 501 is connected to the positive phase trace of the firstplurality of electrical traces 500, the middle section 522 of thepositive phase trace of the second plurality of electrical traces 501 isvertically aligned with the middle section 512 of the negative phasetrace of the first plurality of electrical traces 500. In order tovertically align the middle sections 522, 512, the positive phase traceof the second plurality of electrical traces 501 wraps around the end516 of the negative phase trace of the second plurality of electricaltraces 501 with a wrap around section 522 and the trace angles over byway of a slanted portion 526 to the middle section 522.

Thus, the negative phase trace of the second plurality of electricaltraces 501 has one loop and one slanted portion. Similarly, the positivephase trace of the second plurality of electrical traces also has oneloop and one slanted portion. Therefore, negative phase trace and thepositive phase trace of the second plurality of electrical traces 501have substantially the same length so that the impedance is balanced. Bywrapping the ends of one trace around the end of a second trace that isat the same level, the end of one trace does not need to pass under orover the second trace. Of course, the second plurality of electricaltraces 501 have a longer length than the first plurality of electricaltraces 500. It is to be understood that the first plurality ofelectrical traces 500 and the second plurality of electrical traces 501could be reversed such that the second plurality of electrical traces501 are below the first plurality of electrical traces 500.

FIG. 5B shows a four level trace pattern. Similar to FIG. 5A, the firstplurality of electrical traces 540 includes a positive phase tracehaving ends 541, 542 and a middle section 543 connecting the ends 541,542. The first plurality of electrical traces 540 also includes anegative phase trace having ends 546, 547 as well as a middle section545 connecting the ends 546, 547. Over the first plurality of electricaltraces 540, an insulating layer may be deposited over which the secondplurality of electrical traces 550 is formed. The second plurality ofconductive traces 550 includes a positive phase trace and a negativephase trace. The negative phase trace of the second plurality ofelectrical traces 550 is connected to the negative phase trace of thefirst plurality of electrical traces 540 at the ends 553, 554 to theends 546, 547 of the negative phase trace of the first plurality ofelectrical traces 550. The ends 546, 547, 553, 554 are connected byvertical vias formed through the intervening layers. However, eventhough the negative phase trace of the second plurality of electricaltraces 550 is connected to the negative phase trace of the firstplurality of electrical traces 540, the middle section 555 of thenegative phase trace of the second plurality of electrical traces 550 isvertically aligned with the middle section 543 of the positive trace ofthe first plurality of electrical traces 540. In order to verticallyalign the middle sections 555, 543, the negative phase trace of thesecond plurality of electrical traces 550 wraps around the end 551 ofthe positive phase trace of the second plurality of electrical traces550 with a wrap around section 558 and the trace angles over by way of aslanted portion 557 to the middle section 555.

Similarly, the positive phase trace of the second plurality ofelectrical traces 550 is connected to the positive phase trace of thefirst plurality of electrical traces 540 at the ends 551, 552 to theends 541, 542 of the positive phase trace of the first plurality ofelectrical traces 540. The ends 541, 542, 551, 552 are connected byvertical vias formed through the intervening layers. However, eventhough the positive phase trace of the second plurality of electricaltraces 550 is connected to the positive phase trace of the firstplurality of electrical traces 540, the middle section 556 of thepositive phase trace of the second plurality of electrical traces 550 isvertically aligned with the middle section 545 of the negative phasetrace of the first plurality of electrical traces 540. In order tovertically align the middle sections 556, 545, the positive phase traceof the second plurality of electrical traces 550 wraps around the end553 of the negative phase trace of the second plurality of electricaltraces 550 with a wrap around section 559 and the trace angles over byway of a slanted portion 560 to the middle section 556.

Over the second plurality of electrical traces 550, another insulationlayer may be deposited. Thereover, a third plurality of electricaltraces 570 may be formed. The third plurality of electrical traces 570includes a positive phase trace having ends 571, 572 connected by amiddle section 573. The positive phase trace is vertically aligned withthe positive phase trace of the first plurality of electrical traces 540and connected thereto at the ends 571, 572, 541, 542 through vias formedthrough intervening layers. The positive phase trace is also connectedto the ends 551, 552 of the positive phase trace of the second pluralityof electrical traces 550. Similarly, the third plurality of electricaltraces 570 includes a negative phase trace having ends 574, 575connected by a middle section 576. The negative phase trace isvertically aligned with the negative phase trace of the first pluralityof electrical traces 540 and connected thereto at the ends 574, 575,547, 546 through vias formed through intervening layers. The negativephase race is also connected to the ends 557, 558 of the negative phasetrace of the second plurality of electrical traces 550.

Over the third plurality of electrical traces 570, an insulating layermay be deposited over which the fourth plurality of electrical traces580 is formed. The fourth plurality of conductive traces 580 includes apositive phase trace and a negative phase trace. The negative phasetrace of the fourth plurality of electrical traces 580 is connected tothe negative phase trace of the third plurality of electrical traces 570at the ends 586, 590 to the ends 574, 575 of the negative phase trace ofthe third plurality of electrical traces 570. The ends 574, 575, 586,590 are connected by vertical vias formed through the interveninglayers. However, even though the negative phase trace of the fourthplurality of electrical traces 580 is connected to the negative phasetrace of the third plurality of electrical traces 570, the middlesection 588 of the negative phase trace of the fourth plurality ofelectrical traces 580 is vertically aligned with the middle section 573of the positive trace of the third plurality of electrical traces 570.In order to vertically align the middle sections 588, 573, the negativephase trace of the fourth plurality of electrical traces 580 wrapsaround the end 585 of the positive phase trace of the fourth pluralityof electrical traces 580 with a wrap around section 589 and the traceangles over by way of a slanted portion 587 to the middle section 588.

Similarly, the positive phase trace of the fourth plurality ofelectrical traces 580 is connected to the positive phase trace of thethird plurality of electrical traces 570 at the ends 581, 585 to theends 571, 572 of the positive phase trace of the third plurality ofelectrical traces 570. The ends 571, 572, 571, 585 are connected byvertical vias formed through the intervening layers. However, eventhough the positive phase trace of the fourth plurality of electricaltraces 580 is connected to the positive phase trace of the thirdplurality of electrical traces 570, the middle section 583 of thepositive phase trace of the fourth plurality of electrical traces 580 isvertically aligned with the middle section 576 of the negative phasetrace of the third plurality of electrical traces 570. In order tovertically align the middle sections 583, 576, the positive phase traceof the fourth plurality of electrical traces 580 wraps around the end586 of the negative phase trace of the fourth plurality of electricaltraces 580 with a wrap around section 582 and the trace angles over byway of a slanted portion 585 to the middle section 583.

In FIG. 5B, the positive phase traces of both the first plurality ofelectrical traces 540 and the third plurality of electrical traces 570are vertically aligned and have substantially the same length.Similarly, the negative phase traces of both the first plurality ofelectrical traces 540 and the third plurality of electrical traces 570are vertically aligned and have substantially the same length. Thepositive phase traces of both the second plurality of electrical traces550 and the fourth plurality of electrical traces 580 are verticallyaligned and have substantially the same length. Similarly, the negativephase traces of both the second plurality of electrical traces 550 andthe fourth plurality of electrical traces 580 are vertically aligned andhave substantially the same length. Both the positive phase trace andthe negative phase trace of the first plurality of electrical traces 540have substantially the same length and thus, substantially the sameimpedance. Both the positive phase trace and the negative phase trace ofthe second plurality of electrical traces 550 have substantially thesame length and thus, substantially the same impedance. Both thepositive phase trace and the negative phase trace of the third pluralityof electrical traces 570 have substantially the same length and thus,substantially the same impedance. Both the positive phase trace and thenegative phase trace of the fourth plurality of electrical traces 580have substantially the same length and thus, substantially the sameimpedance.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

What is claimed is:
 1. An interleaved conductor structure forelectrically connecting between the read/write electronics and a headand head slider adjacent to a magnetic recording disk, the interleavedconductor structure comprising: a conductive underlayer; a firstelectrical insulation layer disposed over the conductive underlayer; afirst plurality of electrical traces disposed on the first electricalinsulation layer and spaced apart from each other by a first distance,each electrical trace of the first plurality of electrical traces havinga first width; a second electrical insulation layer disposed on thefirst plurality of electrical traces; and a second plurality ofelectrical traces disposed on the second electrical insulation layer andspaced apart from each other by a second distance that is substantiallyequal to the first distance, each electrical trace of the secondplurality of electrical traces has a second width, wherein eachelectrical trace of the second plurality of electrical traces is offsetfrom each electrical trace of the first plurality of electrical traces,wherein the first and second plurality of electrical traces each includenegative and positive phase traces, wherein the first plurality ofelectrical traces are interleaved relative to the second plurality ofelectrical traces, and wherein a periodic maximum trace length is lessthan 1/10 of the wavelength of a maximum symbol transfer rate.
 2. Theinterleaved conductor structure of claim 1, wherein the second width issubstantially equal to the first distance.
 3. The interleaved conductorstructure of claim 1, wherein the first width is different than thesecond width.
 4. The interleaved conductor structure of claim 1, whereineach electrical trace of the second plurality of electrical traces isoffset from a corresponding electrical trace of the first plurality ofelectrical traces by a substantially equal distance.
 5. The interleavedconductor structure of claim 4, further comprising a first conductivelayer disposed between the conductive underlayer and the firstelectrical insulation layer.
 6. The interleaved conductor structure ofclaim 5, wherein the first conductive layer comprises a highlyconductive material chosen from the group consisting of gold (Au) andcopper (Cu).
 7. The interleaved conductor structure of claim 1, whereinthe conductive underlayer has at least one aperture extendingtherethrough.
 8. The interleaved conductor structure of claim 1, furthercomprising a first conductive layer disposed between the conductiveunderlayer and the first electrical insulation layer.
 9. The interleavedconductor structure of claim 8, further comprising a second conductivelayer disposed over the second plurality of electrical traces.
 10. Theinterleaved conductor structure of claim 9, wherein the first conductivelayer and the second conductive layer each comprise a highly conductivematerial chosen from the group consisting of gold (Au) and copper (Cu).11. The interleaved conductor structure of claim 1, wherein the firstwidth is equal to the second width.
 12. The interleaved conductorstructure of claim 1, wherein the offset of the second plurality ofelectrical traces relative to the first plurality of electrical tracesis periodic to create a serpentine appearance.
 13. The interleavedconductor structure of claim 1, wherein each trace of the secondplurality of electrical traces is offset from a corresponding trace ofthe first plurality of electrical traces by a substantially equaldistance.
 14. The interleaved conductor structure of claim 1, whereinthe conductive underlayer is a stiffener layer of conductive material.15. The interleaved conductor structure of claim 1, wherein theconductive underlayer is an elongated conductive suspension member. 16.An interleaved conductor structure for electrically connecting betweenthe read/write electronics and a head and head slider adjacent to amagnetic recording disk, the interleaved conductor structure comprising:a conductive underlayer; a first electrical insulation layer disposedover the conductive underlayer; a first plurality of electrical tracesdisposed on the first electrical insulation layer and spaced apart by afirst distance, each electrical trace of the first plurality ofelectrical traces having a first width; a second electrical insulationlayer disposed on the first plurality of electrical traces; a secondplurality of electrical traces disposed on the second electricalinsulation layer and spaced apart by a second distance substantiallyequal to the first distance, each electrical trace of the secondplurality of electrical traces has a second width, wherein eachelectrical trace of the second plurality of electrical traces is offsetfrom each electrical trace of the first plurality of electrical traces,wherein the first and second plurality of electrical traces each includenegative and positive phase traces, wherein the first plurality ofelectrical traces are interleaved relative to the second plurality ofelectrical traces, and wherein a periodic maximum trace length is lessthan 1/10 of the wavelength of a maximum symbol transfer rate; a thirdelectrical insulation layer disposed on the second plurality ofelectrical traces; and a top conductive shield layer disposed on thethird electrical insulation layer.
 17. The interleaved conductorstructure of claim 16, further comprising a first conductive layerdisposed between the conductive underlayer and the first electricalinsulation layer.
 18. The interleaved conductor structure of claim 17,wherein the first conductive layer comprises a highly conductivematerial chosen from the group consisting of gold (Au) and copper (Cu).19. The interleaved conductor structure of claim 16, wherein theconductive underlayer has at least one aperture extending therethrough.20. The interleaved conductor structure of claim 16, wherein the secondwidth is substantially equal to the first distance.
 21. The interleavedconductor structure of claim 19, wherein the first width is differentthan the second width.
 22. The interleaved conductor structure of claim16, wherein the offset of the second plurality of electrical tracesrelative to the first plurality of electrical traces is periodic tocreate a serpentine appearance.
 23. The interleaved conductor structureof claim 16, wherein each trace of the second plurality of electricaltraces is offset from a corresponding trace of the first plurality ofelectrical traces by a substantially equal distance.
 24. The interleavedconductor structure of claim 16, wherein the conductive underlayer is astiffener layer of conductive material.
 25. The interleaved conductorstructure of claim 16, wherein the conductive underlayer is an elongatedconductive suspension member.
 26. An interleaved conductor structure forelectrically connecting between the read/write electronics and a headand head slider adjacent to a magnetic recording disk, the interleavedconductor structure comprising: a conductive underlayer having at leastone aperture extending therethrough; a first conductive layer disposedon the conductive underlayer; a first electrical insulation layerdisposed on the first conductive layer; a first plurality of electricaltraces disposed on the first electrical insulation layer and spacedapart by a first distance, each electrical trace of the first pluralityof electrical traces having a first width; a second electricalinsulation layer disposed on the first plurality of electrical traces; asecond plurality of electrical traces disposed on the second electricalinsulation layer and spaced apart by a second distance substantiallyequal to the first distance, each electrical trace of the secondplurality of electrical traces has a second width, wherein eachelectrical trace of the second plurality of electrical traces is offsetfrom each electrical trace of the first plurality of electrical traces,wherein the first and second plurality of electrical traces each includenegative and positive phase traces, wherein the first plurality ofelectrical traces are interleaved relative to the second plurality ofelectrical traces, and wherein a periodic maximum trace length is lessthan 1/10 of the wavelength of a maximum symbol transfer rate; a thirdelectrical insulation layer disposed on the second plurality ofelectrical traces; and a top conductive shield layer disposed on thethird electrical insulation layer.
 27. The interleaved conductorstructure of claim 26, wherein the first conductive layer comprises ahighly conductive material chosen from the group consisting of gold (Au)and copper (Cu).
 28. The interleaved conductor structure of claim 27,wherein the second width is substantially equal to the first distance.29. The interleaved conductor structure of claim 26, wherein the offsetof the second plurality of electrical traces relative to the firstplurality of electrical traces is periodic to create a serpentineappearance.
 30. The interleaved conductor structure of claim 26, whereineach trace of the second plurality of electrical traces is offset from acorresponding trace of the first plurality of electrical traces by asubstantially equal distance.
 31. The interleaved conductor structure ofclaim 26, wherein the conductive underlayer is a stiffener layer ofconductive material.
 32. The interleaved conductor structure of claim26, wherein the conductive underlayer is an elongated conductivesuspension member.